Yole Développement announce the release of its latest research study about 3D silicon and glass interposers, named 3D Silicon and Glass Interposers: Technologies, Applications and Markets. This report contains a list of all the 3D silicon/glass interposer opportunities by application.
Yole Développement analyze the key drivers, expected benefits, and the various technology options and alternatives. In addition, the company will cover the 3D interposer industry players and the respective supply chain changes.

“These players, in search of growth opportunities, have positioned as service providers for the back-end operations for the making of through silicon vias (TSV’s) and other related wafer-level assembly operations," explains Jean-Marc Yannou, Project Manager at Yole Développement. "Thanks to 3D silicon/ glass interposers, they can go one step further, and actually propose products combined with their service offer."